374724B00035G

374724B00035G
Mfr. #:
374724B00035G
メーカー:
Aavid, Thermal Division of Boyd Corporation
説明:
Heat Sinks Heatsink for Plastic BGA Packages, Black Anodized, 35x35x18mm, IC Pkg Size = 35 x 35, Tape #35
ライフサイクル:
メーカー新製品
データシート:
374724B00035G データシート
配達:
DHL FedEx Ups TNT EMS
支払い:
T/T Paypal Visa MoneyGram Western Union
HTML Datasheet:
374724B00035G Datasheet
ECAD Model:
製品属性
属性値
メーカー:
Aavid
製品カテゴリ:
ヒートシンク
JBoss:
Y
製品:
ヒートシンク
取り付けスタイル:
接着剤
フィンスタイル:
全方向フィン
熱抵抗:
15.3 C/W
長さ:
35 mm
幅:
35 mm
高さ:
18 mm
設計対象:
BGA
色:
シリーズ:
3747
ブランド:
Aavid
製品タイプ:
ヒートシンク
ファクトリーパックの数量:
670
サブカテゴリ:
ヒートシンク
Tags
374724B0, 374724, 37472, 3747, 374
Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1: Vacuum Packaging with PL
Step1:
Vacuum Packaging with PL
Step2: Anti-Static Bag
Step2:
Anti-Static Bag
Step3: Packaging Boxes
Step3:
Packaging Boxes
***er Electronics
Heat Sinks Heatsink for Plastic BGA Packages, Black Anodized, 35x35x18mm, IC Pkg Size = 35 x 35, Tape #35
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Heat Sink, For Ball Grid Array, BGA, 15.3 °C/W, 18 mm, 35 mm, 35 mm
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Heat Sink Passive BGA Pin Array Tape 15.3C/W Black Anodized
***i-Key
HEATSINK BGA 35X35X18MM W/ADH
***nell
HEAT SINK BGA 35 X 35 X 18 WITH PAD; IC - Transistor Case:BGA; Thermal Resistance:15.3°C/W; External Width:35mm; Height:18mm; External Height:18mm; Length:35mm; Mounting Type:Adhesive Mount; Package / Case:BGA
***ark
HEAT SINK; Thermal Resistance:15.3�C/W; Packages Cooled:BGA; External Width - Metric:35mm; External Height - Metric:18mm; External Length - Metric:35mm; External Diameter - Metric:-; Heat Sink Material:Aluminium; Product Range:- RoHS Compliant: Yes
***ment14 APAC
HEAT SINK BGA 35 X 35 X 18 WITH PAD; Packages Cooled:BGA; Thermal Resistance:15.3°C/W; SVHC:No SVHC (20-Jun-2011); External Height:18mm; External Width:35mm; Height:18mm; Length:35mm; Mounting Type:Adhesive Mount; Package / Case:BGA; Width:35mm
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可用性
ストック:
277
注文中:
2260
数量を入力してください:
374724B00035Gの現在の価格は参考用です。最高の価格をご希望の場合は、お問い合わせまたは直接メールで営業チーム[email protected]までご連絡ください。
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