MSP430FR5721IDA

Mfr. #:: MSP430FR5721IDA
説明:: Microcontrollers - MCU 16-bit Microcontrollers - MCU Mixed Signal MCU
ライフサイクル:: メーカー新製品
データシート:: MSP430FR5721IDA データシート
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詳しくは:: MSP430FR5721IDA 詳しくは MSP430FR5721IDA Product Details

製品属性
属性値

メーカー: テキサスインスツルメンツ

製品カテゴリ: 組み込み-マイクロコントローラー

シリーズ: MSP430 FRAM

包装: チューブ代替包装

単位重量: 0.007189 oz

取り付けスタイル: SMD / SMT

商標名: MSP430

パッケージ-ケース: TSSOP-38

作動温度: -40°C ~ 85°C (TA)

サプライヤー-デバイス-パッケージ: 38-TSSOP

IOの数: 30

スピード: 8MHz

EEPROM-サイズ: -

コアプロセッサ: CPUXV2

RAMサイズ: 1K x 8

プログラムメモリタイプ: FRAM

周辺機器: ブラウンアウト検出/リセット、POR、PWM、WDT

接続性: I2C, IrDA, LIN, SCI, SPI, UART/USART

電圧供給-Vcc-Vdd: 2 V ~ 3.6 V

コアサイズ: 16-Bit

プログラム-メモリ-サイズ: 4KB (4K x 8)

データコンバーター: A/D 14x10b

オシレータータイプ: 内部

最高作動温度: + 85 C

最低作動温度: - 40 C

動作-供給-電圧: 2 V to 3.6 V

インターフェイスタイプ: I2C SPI UART USB

芯: MSP430

プロセッサシリーズ: MSP430FR572x

データバス幅: 16 bit

最大クロック周波数: 8 MHz

ADCチャネルの数: 14 Channel

I-Oの数: 30 I/O

データ-RAM-サイズ: 1 kB

タイマーの数-カウンター: 5 Timer

ADC-解像度: 10 bit SAR

データRAMタイプ: SRAM

Tags: MSP430FR5721, MSP430FR572, MSP430FR57, MSP430FR5, MSP430FR, MSP430F, MSP430, MSP43, MSP4, MSP

Service Guarantees

We guarantee 100% customer satisfaction.

Quality Guarantees

We provide 90-360 days warranty.

If the items you received were not in perfect quality, we would be responsible for your refund or replacement, but the items must be returned in their original condition.
Our experienced sales team and tech support team back our services to satisfy all our customers.

we buy and manage excess electronic components, including excess inventory identified for disposal.
Email us if you have excess stock to sell.

Email: [email protected]

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes

MSP430FR5721IDA 説明

***as Instruments: 8 MHz MCU with 4KB FRAM, 1KB SRAM, 10-bit ADC, Comparator, UART/SPI/I2C, Timer 38-TSSOP -40 to 85

***ical: MCU 16-bit MSP430 MSP430 RISC ROMLess 2.5V/3.3V 38-Pin TSSOP

***ark: Ultra low power Micro Controller

MSP430FR5721IDA 詳しくは

Processors: OMO Electronic Processors provide a comprehensive portfolio, proven software, and worldwide support enabling industry-leading automotive and industrial solutions. TI is dedicated to advancing and optimizing today’s processors to meet tomorrow’s intelligence, performance and cost requirements in automotive and industrial applications. Scalable hardware and software platforms with common code allow designers to seamlessly reuse and migrate across devices to protect future investment.

OMO Electronic Power for Processors: OMO Electronic SIMPLE SWITCHER® nano modules and regulators can be paired with TI high-performance processors to create the ideal power solution for your space-constrained application. SIMPLE SWITCHER nano modules and regulators make power design easy for MSP430™, C2000™, and Stellaris® microcontrollers (MCUs) as well as Sitara™ microprocessors (MPUs) and C6000™ digital signal processors (DSPs).Learn More

MSP430FRx Ultra Low-Power FRAM MCUs: OMO Electronic MSP430FRx Ultra Low-Power FRAM Microcontrollers (MCUs) consist of embedded FRAM non-volatile memory plus an ultra-low-power 16-bit MSP430 CPU, and different peripherals targeted for various applications. These MCUs feature seven low-power modes that are optimized to achieve extended battery life in portable and wireless sensing applications. With FRAM non-volatile memory, it combines the speed, flexibility, and endurance of SRAM with the stability and reliability of flash with lower total power consumption. These devices include a variety of peripherals, including a 10-bit ADCs, 16-channel comparator, and hysteresis capabilities, three enhanced serial channels capable of I2C, SPI, or UART protocols, internal DMA, hardware multiplier, real-time clock, five 16-bit timers, and more. These devices are ideal for use in cold chain applications because they allow the engineer to write quicker to save power. By using flexible non-volatile FRAM you can store application, data or both. By using FRAM, it also allows the highest reliability by being able to log data continuously with a 1015 write endurance and proven 10-year data retention at 85ºC. The MSP430FRx-EP devices have gold bondwires, a temperature range of –55 to +105°C and include a SnPb lead finish.

Market price

モデル	説明	ストック	価格
MSP430FR5721IDA DISTI # MSP430FR5721IDA-ND	IC MCU 16BIT 4KB FRAM 38TSSOP RoHS: Compliant Min Qty: 240 Container: Tube	Temporarily Out of Stock	240:$2.1040
MSP430FR5721IDAR DISTI # MSP430FR5721IDAR-ND	IC MCU 16BIT 4KB FRAM 38TSSOP RoHS: Compliant Min Qty: 2000 Container: Tape & Reel (TR)	Temporarily Out of Stock	2000:$1.3406
MSP430FR5721IDA DISTI # MSP430FR5721IDA	MCU 16-bit MSP430 RISC ROMLess 2.5V/3.3V 38-Pin TSSOP - Trays (Alt: MSP430FR5721IDA) RoHS: Compliant Min Qty: 240 Container: Tray	Americas - 0	240:$1.7900 320:$1.6900 560:$1.5900 1200:$1.5900 2400:$1.5900
MSP430FR5721IDA DISTI # MSP430FR5721IDA	MCU 16-bit MSP430 RISC ROMLess 2.5V/3.3V 38-Pin TSSOP (Alt: MSP430FR5721IDA) RoHS: Compliant Min Qty: 40	Europe - 0	40:€1.7900 80:€1.5900 160:€1.3900 240:€1.2900 400:€1.2900
MSP430FR5721IDAR DISTI # MSP430FR5721IDAR	MCU 16-bit MSP430 RISC ROMLess 2.5V/3.3V 38-Pin TSSOP T/R - Tape and Reel (Alt: MSP430FR5721IDAR) RoHS: Compliant Min Qty: 2000 Container: Reel	Americas - 0	2000:$1.3900 4000:$1.2900 8000:$1.2900 12000:$1.2900 20000:$1.1900
MSP430FR5721IDAR DISTI # MSP430FR5721IDAR	MCU 16-bit MSP430 RISC ROMLess 2.5V/3.3V 38-Pin TSSOP T/R (Alt: MSP430FR5721IDAR) RoHS: Compliant Min Qty: 2000 Container: Tape and Reel	Europe - 0	2000:€1.5900 4000:€1.4900 8000:€1.2900 12000:€1.1900 20000:€1.1900
MSP430FR5721IDA DISTI # 595-MSP430FR5721IDA	16-bit Microcontrollers - MCU Mixed Signal MCU RoHS: Compliant	121	1:$2.8600 10:$2.5700 100:$2.1000 250:$1.9700 500:$1.7900 1000:$1.5100 2500:$1.4300 5000:$1.3800
MSP430FR5721IDAR DISTI # 595-MSP430FR5721IDAR	16-bit Microcontrollers - MCU Mixed Signal MCU RoHS: Compliant	0	1:$2.6700 10:$2.4000 100:$1.9600 250:$1.8400 500:$1.6700 1000:$1.4100 2000:$1.3400 4000:$1.2900

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MSP430FR5721IDA

Step1:Vacuum Packaging with PL

Step2:Anti-Static Bag

Step3:Packaging Boxes

Step1:
Vacuum Packaging with PL

Step2:
Anti-Static Bag

Step3:
Packaging Boxes