 | | | |
| PartNumber | 4606X-AP1-223LF | 4606X-AP1-203LF | 4606X-AP1-222LF |
| Description | Resistor Networks & Arrays THICK FILM 2% 22K CONFRML SIP | Resistor Networks & Arrays THICK FILM 2% 20K CONFRML SIP | Resistor Networks & Arrays THICK FILM 2% 2.2K CONFRML SIP |
| Manufacturer | Bourns Inc. | Bourns Inc. | Bourns Inc. |
| Product Category | Resistor Networks, Arrays | Resistor Networks, Arrays | Resistor Networks, Arrays |
| Series | 4600X | 4600X | 4600X |
| Packaging | Tape & Box (TB) Alternate Packaging | Tape & Box (TB) Alternate Packaging | Tape & Box (TB) Alternate Packaging |
| Height | 0.200" (5.08mm) | 0.200" (5.08mm) | 0.200" (5.08mm) |
| Operating Temperature | -55°C ~ 125°C | -55°C ~ 125°C | -55°C ~ 125°C |
| Mounting Type | Through Hole | Through Hole | Through Hole |
| Size Dimension | 0.598" L x 0.098" W (15.19mm x 2.49mm) | 0.598" L x 0.098" W (15.19mm x 2.49mm) | 0.598" L x 0.098" W (15.19mm x 2.49mm) |
| Applications | - | - | - |
| Supplier Device Package | 6-SIP | 6-SIP | 6-SIP |
| Tolerance | ±2% | ±2% | ±2% |
| Temperature Coefficient | ±100ppm/°C | ±100ppm/°C | ±100ppm/°C |
| Circuit Type | Bussed | Bussed | Bussed |
| Resistance Ohms | |||
| Number of Resistors | 5 | 5 | 5 |
| Number of Pins | 6 | 6 | 6 |
| Power Per Element | 200mW | 200mW | 200mW |
| Package Case | 6-SIP | 6-SIP | 6-SIP |
| メーカー | モデル | 説明 | RFQ |
|---|---|---|---|
Bourns |
4606X-AP1-271LF | Resistor Networks & Arrays THICK FILM 2% 270ohm CONFRML SIP | |
| 4606X-AP1-272LF | Resistor Networks & Arrays THICK FILM 2% 2.7K CONFRML SIP | ||
| 4606X-AP1-271LF | Resistor Networks & Arrays THICK FILM 2% 270ohm CONFRML SIP | ||
| 4606X-AP1-224LF | Resistor Networks & Arrays THICK FILM 2% 220K CONFRML SIP | ||
| 4606X-AP1-223LF | Resistor Networks & Arrays THICK FILM 2% 22K CONFRML SIP | ||
| 4606X-AP1-203LF | Resistor Networks & Arrays THICK FILM 2% 20K CONFRML SIP | ||
| 4606X-AP1-222LF | Resistor Networks & Arrays THICK FILM 2% 2.2K CONFRML SIP |